Components code and abbreviation on Laptop motherboard

Components code and abbreviation on Laptop motherboard

COMPONENTS CODE

CODE COMPONENT
C :CAPACITOR
D IODE
F :FUSE
L :INDUCTOR
PC :POWER CAPACITOR
PD :POWER DIODES/DIODE
PL :POWER INDUCTOR
PQ :POWER TRANSISTOR
PR :POWER RESISTOR
PU :POWER INTEGRATED CIRCUIT
Q :TRANSISTOR
R :RESISTOR
T : Transformers
U :INTEGRATED CIRCUIT/BGA CHIP/EMBEDDED CONTROLER/BIOS IC,ETC
X : Terminal strips, terminations, joins .oscilator
Y : Crystal

ABBREVIATION ON LAPTOP MOTHERBOARD FOR SCHEMATIC

AC : Alternating current
ACDRV : AC adapter to system-switch driver output
ACEDET : Adaptor Current Detector
ACGOOD : Valid adapter active-low detect logic open-drain output
ACIN : Adaptor Current sensor Input
ACN : Adapter current sense resistor
ACOP : Input Over-Power Protection
ACOV : Input Overvoltage Protection
ACP : Adapter current sense resistor, positive input.
ADP+ : Adapter Positif Suplay
ADP_ID : Adapter Identity
AGND :Analog Ground
ALWP :ALWAYS ON POWER
B+ : AC OR BAT POWER RAIL FOR POWER CIRCUIT
BATT : Battery

BAT+ :BAT POWER RAIL FOR POWER CIRCUIT
BAT_DRV :Bat Fet Gate Driver
BAT_V Battery Voltage
BOM :BILL OF MATERIAL MANAGEMENT
BT :BUTTON
BT_EN :Bloototh Enable
BUZER :Connected
BYP :Baypass
CHGEN : Charge enable active-low logic input
CIN : Input Capacitor
CLK_EN :CLKOCK ENABLE
CN :CONECTOR
CRT :Cathode ray tube
CSIN :Current Sensor input Negatif
CSIP :Current Sensor input Positif
DC irect current
DM IM/DIM SOCKET/SOKET MEMORY/SOKET DDR
DOCK OCKING SOCKET
EC :Embedded Controler
EC_ON :Embeded Controler Enable
EMI :Elektromagnetik Interference(GANGGUAN ELEKTROMAGNETIK)
EN :ENABLE
ENTRIP :Enable Terminal
F :FUSE
FSEL : Frequency Select Input.
GATE : Trigger gate
GND :Ground
GP :GROUND PIN
GPI :General Power Input
GPIO :General Power Input Output
HDMI :High-Definition Multimedia Interface
ID :Continuous Drain Current
IDM :Pulsed Drain Current
IIN : Operating Supply Current
IIN(SHDN): Shutdown Supply Current
IIN(STBY): Standby Supply Current
IS :Continuous Source Current (Diode Conduction)
IVIN :Battery Supply Current at VIN pin
JP :JUMPER POINT
KBC :Keyboard Controler
LCDV :LCD POWER
LDO :Linear Driver Output
LGATE : Lower-side MOSFET gate signal
LPC :Low Pin Count
LVDS :Low-voltage differential signaling(SYSTEM PENSIGNALAN)
MBAT :MAIN BATTERY
NB :North Bridge
ODD :OUTPUT DISC DRIVE
PCI :Peripheral Component Interconnect
PGOOD : Power good open-drain output
PIR :PRODUCT IMPROVED RECORD
PSI# :Current indicator input
PVCC : IC power positive supply
RSMRST : Resume Reset
RTC :REAL TIME CLOCK
SB : South bridge
SHDN :Shutdown
SYS_SDN :System Shutdown
SPI :Serial Peripheral Interface
TD eath Time
THRM :THERMAL SENSOR
TMDS :Transition Minimized Differential Signaling(TRANSMISI DATA TEKNOLOGY)
TP :TES POINT
TPAD :THERMAL PAD
UVLO : Input Undervoltage Lock Out
V :RAIL(POWER)
V+ :Positive Voltage
VADJ : Output regulation voltage
VALW :ALWAYS ON POWER
VALWP :VALW PAD
VBAT :BATTERY POWER
VCCP :power chip(ich,graphic chips)
VCORE :POWER PROCESOR
VDD : Control power supply
VDDR :POWER DDR (VDRAM/VRAM/VMEM)
VDS :VOLTAGE DRAIN SOURCE
VFB : feedback inputs Power
VGS :VOLTAGE GATE SOURCES
VIN : Input Voltage Range
VIN :ADAPTER POWER SUPLAY(vol_in)
VL :Power Lock
VL :voltage across the load/Tegangan beban resistor
VL :Voltage Linear
VLDOIN :Power supply of the VTT and VTTREF output stage (to powerMOS).
VOT :Volt_out
VRAM :Power Memori
VREF :POWER REFERENCES/SCHEMA REFERENCE/PERMINTAAN SKEMA
VS :SUITCH POWER
VS+ :SUPPORT VOLTAGE POSITIF
VSB :POWER SWITCH BUTTON
VSS : Signal ground.
VSW :POWER SWICT
VTT : Memory Termination Voltage
VTERM :Memory Termination Voltage
VUSB :POWER USB
VGA :POWER VGA (VGPX/VGPU/VCVOD)
VGFX :POWER GRAPHIC CHIP
VREF :VOLTAGE REFERENCES